Chemical mechanical polishing in silicon processing / (Record no. 526903)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 06677cam a2200637Ia 4500 |
| 001 - CONTROL NUMBER | |
| control field | ocn289523077 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | OCoLC |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20180529114255.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 081222s2000 caua ob 001 0 eng d |
| 019 ## - | |
| -- | 301243077 |
| -- | 606398944 |
| -- | 646756450 |
| -- | 808732833 |
| -- | 987671681 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780080864617 |
| Qualifying information | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 0080864619 |
| Qualifying information | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 0127521720 |
| Qualifying information | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780127521725 |
| Qualifying information | (electronic bk.) |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (OCoLC)289523077 |
| 040 ## - CATALOGING SOURCE | |
| Original cataloging agency | DLC |
| Language of cataloging | eng |
| Transcribing agency | DLC |
| Modifying agency | AU |
| 042 ## - AUTHENTICATION CODE | |
| Authentication code | dlr |
| 049 ## - LOCAL HOLDINGS (OCLC) | |
| Holding library | Alfaisal Main Library |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | QC610.9 |
| Item number | .S48eb vol. 63 |
| 245 00 - TITLE STATEMENT | |
| Title | Chemical mechanical polishing in silicon processing / |
| Statement of responsibility, etc | volume editors, Shin Hwa Li, Robert O. Miller. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication, distribution, etc | San Diego, CA : |
| Name of publisher, distributor, etc | Academic Press, |
| Date of publication, distribution, etc | ©2000. |
| 264 ## - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE STATEMENTS | |
| Date of production, publication, distribution, manufacture | ©2000. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 1 online resource (xv, 307 pages) : |
| Other physical details | illustrations. |
| 336 ## - CONTENT TYPE | |
| Content Type Term | text |
| Content Type Code | txt |
| Source | rdacontent |
| 337 ## - MEDIA TYPE | |
| Media Type Term | computer |
| Media Type Code | c |
| Source | rdamedia |
| 338 ## - CARRIER TYPE | |
| Carrier Type Term | online resource |
| Carrier Type Code | cr |
| Source | rdacarrier |
| 490 1# - SERIES STATEMENT | |
| Series statement | Semiconductors and semimetals ; |
| Volume number/sequential designation | v. 63 |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE | |
| Bibliography, etc | Includes bibliographical references and index. |
| 588 0# - | |
| -- | Print version record. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry. |
| 506 ## - RESTRICTIONS ON ACCESS NOTE | |
| Materials specified | Use copy |
| Standardized terminology for access restriction | Restrictions unspecified |
| Source of term | star |
| Institution to which field applies | MiAaHDL |
| 533 ## - REPRODUCTION NOTE | |
| Type of reproduction | Electronic reproduction. |
| Place of reproduction | [S.l.] : |
| Agency responsible for reproduction | HathiTrust Digital Library, |
| Date of reproduction | 2010. |
| -- | MiAaHDL |
| 538 ## - SYSTEM DETAILS NOTE | |
| System details note | Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. |
| Uniform Resource Identifier | <a href="http://purl.oclc.org/DLF/benchrepro0212">http://purl.oclc.org/DLF/benchrepro0212</a> |
| -- | MiAaHDL |
| 583 1# - ACTION NOTE | |
| Action | digitized |
| Time/date of action | 2010 |
| Jurisdiction | HathiTrust Digital Library |
| Status | committed to preserve |
| Source of term | pda |
| Institution to which field applies | MiAaHDL |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Front Cover; Chemical Mechanical Polishing in Silicon Processing; Copyright Page; Contents; Preface; List of Contributors; Chapter 1. Introduction; I. CMP: A Unique and Evolving Semiconductor Fabrication Technology-Past, Present, and Future; Chapter 2. Equipment; I. Introduction; II. CMP Equipment Design Evolution; III. Carriers; IV. Platens; V. Pad Conditioning; VI. CMP Equipment Integration; VII. Copper Polishing and CMP Tool Requirements; VIII. 300-mm CMP Tools; IX. Conclusion; References; Chapter 3. Facilitization; I. Introduction; II. Outline; III. Slurry Distribution System Overview. |
| 505 8# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | IV. Slurry HandlingV. Slurry Distribution Systems; VI. Slurry Dispense Engines; VII. Slurry Blending Technology; VIII. Slurry Measuring Techniques; IX. Daytank Replenishment; X. Mix Order; XI. Piping Systems; XII. Piping System Variations; XIII. Materials of Construction; XIV. Slurry Settling; XV. Slurry Room Location; XVI. Pressure and Flow Consistency; XVII. Back-Pressure Devices; XVIII. Slurry Consumption Ramp; XIX. System Redundancy; XX. Valve Boxes; XXI. Storage Tanks; XXII. Agitation; XXIII. Metrology; XXIV. Filtration; XXV. Slurry System Maintenance; XXVI. Waste Disposal; References. |
| 505 8# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Chapter 4. Modeling and SimulationI. Introduction; II. Wafer-Scale Models; III. Patterned Wafer CMP Modeling; IV. Die-Level Modeling of Ild CMP; V. Models for Metal Polishing; VI. Summary and Status; References; Chapter 5. Consumables I: Slurry; I. Introduction; II. Abrasives; III. Slurry Solution; IV. Comparisons Among Slurries; References; Chapter 6. CMP Consumablesii: Pad; I. Introduction; II. Classes of Pads and Their Manufacture; III. Structure, Properties, and Their Relationship to the Polishing Process; IV. Application to Semiconductor Processing; References; Chapter 7. Post-CMP Clean. |
| 505 8# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | I. IntroductionII. Surface Configurations after CMP Processes; III. Cleaning Requirements after CMP Processes; IV. Corrosion Effects; V. Slurry Removal; VI. Metallic Contamination Removal; VII. Damaged Layer Removal; VIII. Final Passivation; IX. Examples of Practical Post-CMP Cleaning Processes; X. Conclusion; References; Chapter 8. CMP Metrology; I. Introduction; II. Reflectometry; III. Defectivity Monitoring; IV. Noncontact Capacitive Measurement; V. Total X-Ray Fluorescence; VI. Stylus Profilometry (Force Measurement); VII. Atomic Force Microscopy; VIII. Four-Point Probe; References. |
| 505 8# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Chapter 9. Applications and CMP-Related Process ProblemsI. Introduction; II. Oxide CMP Within-Wafer Nonuniformity (WIWNU); III. Post-CMP Oxide Thickness Control; IV. Defectivity; V. Tungsten CMP Problems; VI. Other Problems; References; Index; Contents of Volumes in This Series. |
| 590 ## - LOCAL NOTE (RLIN) | |
| Local note | Elsevier |
| Provenance (VM) [OBSOLETE] | ScienceDirect All Books |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Grinding and polishing. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Silicon. |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | TECHNOLOGY & ENGINEERING |
| General subdivision | Technical & Manufacturing Industries & Trades. |
| Source of heading or term | bisacsh |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Grinding and polishing. |
| Source of heading or term | fast |
| -- | (OCoLC)fst00947952 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Silicon. |
| Source of heading or term | fast |
| -- | (OCoLC)fst01118631 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Fisica geral. |
| Source of heading or term | larpcal |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Silicium. |
| Source of heading or term | ram |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Semiconducteurs. |
| Source of heading or term | ram |
| 655 #7 - INDEX TERM--GENRE/FORM | |
| Genre/form data or focus term | Electronic books. |
| Source of term | local |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Li, Shin Hwa. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Miller, Robert O., |
| Dates associated with a name | 1947- |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | ScienceDirect eBooks. |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Display text | Print version: |
| Title | Chemical mechanical polishing in silicon processing. |
| Place, publisher, and date of publication | San Diego, CA : Academic Press, ©2000 |
| International Standard Book Number | 0127521720 |
| -- | 9780127521725 |
| Record control number | (OCoLC)42707637 |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| Uniform title | Semiconductors and semimetals ; |
| Volume number/sequential designation | v. 63. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="http://ezproxy.alfaisal.edu/login?url=https://www.sciencedirect.com/science/bookseries/00808784/63">http://ezproxy.alfaisal.edu/login?url=https://www.sciencedirect.com/science/bookseries/00808784/63</a> |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | Library of Congress Classification |
| Koha item type | eBooks |
No items available.