Components, packaging and manufacturing technology II :  selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / 
edited by Andy Wu. 
 - 1 online resource (245 pages) :  illustrations. 
 - Applied Mechanics and Materials,  Volume 509  1662-7482 ; .
 - Applied mechanics and materials ;  Volume 509. .
<br/><br/>Includes bibliographical references and indexes. 
<br/><br/><label>ISBN: </label>9783038350132 9783038263944 (e-book) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic apparatus and appliances--Congresses.<br/>Electronic packaging--Congresses.<br/>Microelectronic packaging--Congresses.<br/>Manufacturing processes--Congresses.
<br/><br/><label>Index Terms--Genre/Form: </label><br/>Electronic books.
<br/><br/><label>LC Class. No.: </label>TK7801  / .C667 2014eb 
<br/><br/><label>Dewey Class. No.: </label>621.381