TY  - BOOK
AU  - Kondo,Kazuo
AU  - Akolkar,Rohan N.
AU  - Barkey,Dale P.
AU  - Yokoi,Masayuki
ED  - SpringerLink (Online service)
TI  - Copper Electrodeposition for Nanofabrication of Electronics Devices
T2  - Nanostructure Science and Technology,
SN  - 9781461491767
AV  - QD551-578 
U1  - 541.37 23
PY  - 2014///
CY  - New York, NY
PB  - Springer New York, Imprint: Springer
KW  - Chemistry
KW  - Electrochemistry
KW  - Solid state physics
KW  - Electronics
KW  - Microelectronics
KW  - Nanotechnology
KW  - Electronics and Microelectronics, Instrumentation
KW  - Solid State Physics
KW  - Electronic books
KW  - local
N1  - Copper Electrodeposition -- Suppression Effect and Additive Chemistry -- Acceleration Effect -- Modeling and Simulation -- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects -- Microstructure of Evolution of Copper in Nano-scale Interconnect Features -- Direct Copper Plating -- Through Silicon Via -- Build-up Printed Wiring Boards -- Copper Foil Smooth on Both Sides for Lithium Ion Battery -- Through Hole Plating
N2  - This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners
UR  - http://ezproxy.alfaisal.edu/login?url=http://dx.doi.org/10.1007/978-1-4614-9176-7
ER  -