Characterization of integrated circuit packaging materials  [electronic resource] / 
editors, Thomas M. Moore and Robert G. McKenna. 
 - New York, NY :  Momentum Press,  2010. 
 - 1 online resource (xx, 274 p.) :  ill. 
 - Materials characterization series .
 - Materials characterization series. .
<br/><br/> "First published by Butterworth-Heinemann in 1993...Reissued volume published in 2010 by Momentum Press"--T.p. verso. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/>IC package reliability testing / Lawrence C. Wagner -- Mold compound adhesion and strength / Samuel S. Kim -- Mechanical stress in IC packages / Darvin R. Edwards and Steven K. Groothuis -- Moisture sensitivity and delamination / Thomas M. Moore, Robert G. McKenna, and Shawn J. Kelsall -- Thermal management / Mostafa Aghazedeh -- Electrical performance of IC packages / Eric Bogatin -- Solderability of integrated circuits / James A. Kargol, Anthony M. Petrucci, and Timothy M. McGuiggan -- Hermeticity and joining in ceramic IC packages / Stephen R. Martin -- Advanced interconnect technology / Robert G. McKenna and Thomas M. Moore. 
<br/><br/><label>ISBN: </label>
<br/><br/><label>Source: </label>CL0500000112  Safari Books Online 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Materials.<br/>Integrated circuits--Design and construction.
<br/><br/><label>Index Terms--Genre/Form: </label><br/>Electronic books.