Area array packaging handbook - Gilleo, Ken.; Lasky, Ronald. C.; Morvan, Y.; Smith, Lee.; Fjelstad, Joseph; Yasumura, Gary.; Kim, Young Gon.; Randolph, Steve; Sanders, John.; Cole, Marie S.; Bates, Bill.; Chen, Tim.; et al. (New York : McGraw-Hill, 2002)
Print version c2002.
Includes bibliographical references.
Also issued in print and PDF version.
Contributor biographical information
Description based on cover image and table of contents, viewed on April 18, 2007.
Keywords: Ball grid array technology; Microelectronic packaging; Electronics industries; Electronic packaging; Integrated circuits industry; Flip chip technology; Polymers; Electronics -- Materials; Hermetic sealing; Adhesives; Solder and soldering; Multichip modules (Microelectronics) -- Testing; Screen process printing; Software measurement; Electronic apparatus and appliances -- Costs; Surface mount technology; Electronic books