Introduction to system-on-package (SOP) miniaturization of the entire system - Tummala, Rao R., 1942-; Swaminathan, Madhavan; Bandyopadhyay, Tapobrata; Mehendale, Mahesh; Rao, Jagdish; Lee, Baik-Woo.; Yoon, Chong K.; Brown, Kenneth M.; Engin, A. Ege.; Govind, Vinu.; Bavisi, Amit.; Papapolymerou, John.; et al. (New York : McGraw-Hill, 2008)
Print version c2008.
Includes bibliographical references and index.
Also issued in print and PDF version.
Description based on cover image and table of contents, viewed on October 21, 2008.
Keywords: Multichip modules (Microelectronics) -- Design and construction; Microelectronic packaging; Electronic books