TY  - BOOK
AU  - Tummala,Rao R.
AU  - Morris,James E.
AU  - Davidson,Evan
AU  - Sarma,D.H.R.
AU  - Hubbard,Bob
AU  - Rao,N.J.
AU  - Swaminathan,Madhavan
AU  - Peterson,Andrew F.
AU  - Kim,Juongho
AU  - Sitaraman,Suresh K.
AU  - Pang,John H.L.
AU  - Bar-Cohen,Avram
AU  - Watwe,Abhay
AU  - Seetharamu,Kankanhally N.
AU  - Kamath,Sundar M.
AU  - Charles,Harry K.
AU  - Baldwin,David F.
AU  - Garrou,Phil
AU  - Prymak,John
AU  - Bhattacharya,Swapan
AU  - Paik,Kyung
AU  - Cruz Rivera,Jose L.
AU  - Gaylord,Thomas K.
AU  - Glytsis,Elias N.
AU  - Laskar,Joy
AU  - Tentzeris,Emmanouil M.
AU  - Schutt-Aine,Jose E.
AU  - Ramesham,Rajeshuni
AU  - Ghaffarian,Reza
AU  - Ayazi,Farrokh
AU  - Wong,C.P.
AU  - Fang,Treliant
AU  - Varadarajan,Mahesh
AU  - Illyefalvi-Vitez,Zsolt
AU  - ZImmermann,Joachim
AU  - Mattsson,Fredrik
AU  - Kandelid,Stefan
AU  - Raj,Pulugurtha Markondeya
AU  - Liu,Johan
AU  - Ohlckers,Per
AU  - Keezer,David
AU  - Kim,Bruce
AU  - Koppolu,Sasidhar
AU  - May,Gary S.
AU  - Shinotani,Ken-ichi
AU  - Malmodin,Jens
AU  - Trankell,Richard
AU  - Qu,Jianmin
AU  - Guo,Yifan
ED  - McGraw-Hill eBooks.
TI  - Fundamentals of microsystems packaging
T2  - McGraw-Hill's AccessEngineering
AV  - TK7870.15 .F86 2001
U1  - 621.381/046 22
PY  - 2001///]
CY  - New York
PB  - McGraw-Hill
KW  - Electronic packaging
KW  - Microelectronic packaging
KW  - Miniature electronic equipment
KW  - Packaging
KW  - Design
KW  - Electronic apparatus and appliances
KW  - Temperature control
KW  - Chip scale packaging
KW  - Multichip modules (Microelectonics)
KW  - Integrated circuits
KW  - Integrated circuits industry
KW  - Passive components
KW  - Integrated passive components
KW  - Optoelectronics
KW  - Radio frequency integrated circuits
KW  - Microelectromechanical systems
KW  - Sealing (Technology)
KW  - Miniature electronic equipment (Bonding)
KW  - Plastic embedment
KW  - Electronics
KW  - Materials
KW  - Surfaces
KW  - Semiconductors
KW  - Printed circuits
KW  - Design and construction
KW  - Surface mount technology
KW  - Testing
KW  - Microelectronics
KW  - Reliability
KW  - Electronic books
KW  - local
N1  - Print version c2001; Includes bibliographical references and index; http://www.loc.gov/catdir/toc/mh023/2001273178.html; Also issued in print and PDF version
UR  - http://ezproxy.alfaisal.edu/login?url=http://accessengineeringlibrary.com/browse/fundamentals-of-microsystems-packaging
ER  -