Results
|
1.
|
|
Image from Amazon.com
|
|
|
2.
|
|
Image from Amazon.com
|
|
|
3.
|
|
Image from Amazon.com
|
|
|
4.
|
|
Image from Amazon.com
|
|
|
5.
|
|
Image from Amazon.com
|
|
|
6.
|
|
Image from Amazon.com
|
|
|
7.
|
|
Image from Amazon.com
|
|
|
8.
|
|
|
|
|
9.
|
|
Image from Amazon.com
|
|
|
10.
|
|
|
|
|
11.
|
|
Image from Amazon.com
|
|
|
12.
|
|
Image from Amazon.com
|
Fundamentals of microsystems packaging [electronic resource] / Rao R. Tummala, editor. by
- Tummala, Rao R, 1942-
- Morris, James E
- Davidson, Evan
- Sarma, D. H. R
- Hubbard, Bob
- Rao, N. J
- Swaminathan, Madhavan
- Peterson, Andrew F
- Kim, Juongho
- Sitaraman, Suresh K
- Pang, John H. L
- Bar-Cohen, Avram
- Watwe, Abhay
- Seetharamu, Kankanhally N
- Kamath, Sundar M
- Charles, Harry K
- Baldwin, David F
- Garrou, Phil
- Prymak, John
- Bhattacharya, Swapan
- Paik, Kyung
- Cruz Rivera, Jose L
- Gaylord, Thomas K
- Glytsis, Elias N
- Laskar, Joy
- Tentzeris, Emmanouil M
- Schutt-Aine, Jose E
- Ramesham, Rajeshuni
- Ghaffarian, Reza
- Ayazi, Farrokh
- Wong, C. P
- Fang, Treliant
- Varadarajan, Mahesh
- Illyefalvi-Vitez, Zsolt
- ZImmermann, Joachim
- Mattsson, Fredrik
- Kandelid, Stefan
- Raj, Pulugurtha Markondeya
- Liu, Johan
- Ohlckers, Per
- Keezer, David
- Kim, Bruce
- Koppolu, Sasidhar
- May, Gary S
- Shinotani, Ken-ichi
- Malmodin, Jens
- Trankell, Richard
- Qu, Jianmin
- Guo, Yifan
- McGraw-Hill eBooks
Series: McGraw-Hill's AccessEngineering
Publication details: New York : McGraw-Hill, [2001]
Availability: No items available.
|