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	1.		Image from Amazon.com	Advanced MEMS packaging [electronic resource] / John H. Lau ... [et al.]. by Lau, John H Lee, Chengkuo Premachandran, C. S Aibin, Yu McGraw-Hill eBooks Series: McGraw-Hill's AccessEngineering Publication details: New York : McGraw-Hill, [2010] Other title: Advanced microelectromechanical systems packaging Online resources: Subscription required Availability: No items available. Place hold Save to lists Add to cart (remove)
	2.		Image from Amazon.com	Through-Silicon Vias for 3D Integration / John H. Lau. by Lau, John H [author.] McGraw-Hill eBooks Language: English Publisher: New York, N.Y. : McGraw-Hill Education LLC., c2013Copyright date: ©2013 Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
	3.		Image from Amazon.com	Microvias : for low-cost, high-density interconnects [electronic resource] / John H. Lau, S.W. Ricky Lee. by Lau, John H Lee, S. W. Ricky McGraw-Hill eBooks Series: McGraw-Hill's AccessEngineering Publication details: New York : McGraw-Hill, [2001] Online resources: Subscription required Availability: No items available. Place hold Save to lists Add to cart (remove)
	4.		Image from Amazon.com	3D IC integration and packaging / John H. Lau. by Lau, John H [author.] McGraw-Hill eBooks Language: English Publisher: New York, N.Y. : McGraw-Hill Education LLC., c2016Copyright date: ©2016 Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
	5.		Image from Amazon.com	Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials [electronic resource] / John H. Lau ... [et al.]. by Lau, John H McGraw-Hill eBooks Series: McGraw-Hill's AccessEngineering Publication details: New York : McGraw-Hill, [2003] Online resources: Subscription required Availability: No items available. Place hold Save to lists Add to cart (remove)
	6.		Image from Amazon.com	Reliability of RoHS-Compliant 2D and 3D IC interconnects [electronic resource] / John H. Lau. by Lau, John H McGraw-Hill eBooks Series: McGraw-Hill's AccessEngineering \| McGraw-Hill electronic engineering series Publication details: New York : McGraw-Hill, [2011] Online resources: Subscription required Availability: No items available. Place hold Save to lists Add to cart (remove)

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