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Proceedings of the 2nd International Conference on Intelligent Technologies and Engineering Systems (ICITES2013) [electronic resource] / edited by Jengnan Juang, Cheng-Yi Chen, Cheng-Fu Yang.

Contributor(s): Series: Lecture Notes in Electrical Engineering ; 293Publisher: Cham : Springer International Publishing : Imprint: Springer, 2014Description: XXII, 1290 p. 780 illus. online resourceContent type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9783319045733
Subject(s): Genre/Form: Additional physical formats: Printed edition:: No titleDDC classification:
  • 621.382 23
LOC classification:
  • TK1-9971
Online resources:
Contents:
Networking -- Signal Processing -- Artificial Intelligence -- Control and Software Engineering -- Intelligent Electronic Circuits and Systems -- Communications -- Material and Mechanical Engineering -- Advanced Material.
In: Springer eBooksSummary: This book includes the original, peer reviewed research papers from the 2nd International Conference on Intelligent Technologies and Engineering Systems (ICITES2013), which took place on December 12-14, 2013 at Cheng Shiu University in Kaohsiung, Taiwan. Topics covered include: laser technology, wireless and mobile networking, lean and agile manufacturing, speech processing, microwave dielectrics, intelligent circuits and systems, 3D graphics, communications, and structure dynamics and control.
Item type: eBooks
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Networking -- Signal Processing -- Artificial Intelligence -- Control and Software Engineering -- Intelligent Electronic Circuits and Systems -- Communications -- Material and Mechanical Engineering -- Advanced Material.

This book includes the original, peer reviewed research papers from the 2nd International Conference on Intelligent Technologies and Engineering Systems (ICITES2013), which took place on December 12-14, 2013 at Cheng Shiu University in Kaohsiung, Taiwan. Topics covered include: laser technology, wireless and mobile networking, lean and agile manufacturing, speech processing, microwave dielectrics, intelligent circuits and systems, 3D graphics, communications, and structure dynamics and control.

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