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VLSI-SoC: Internet of Things Foundations [electronic resource] : 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, Playa del Carmen, Mexico, October 6-8, 2014, Revised Selected Papers / edited by Luc Claesen, Maria-Teresa Sanz-Pascual, Ricardo Reis, Arturo Sarmiento-Reyes.

Contributor(s): Series: IFIP Advances in Information and Communication Technology ; 464Publisher: Cham : Springer International Publishing : Imprint: Springer, 2015Edition: 1st ed. 2015Description: XIV, 241 p. 150 illus. in color. online resourceContent type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9783319252797
Subject(s): Genre/Form: Additional physical formats: Printed edition:: No titleDDC classification:
  • 004.6 23
LOC classification:
  • QA76.9.C643
  • TK5105.5-5105.9
Online resources: In: Springer eBooksSummary: This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
Item type: eBooks
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This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.

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