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Hybrid microcircuit technology handbook : materials, processes, design, testing and production / by James J. Licari and Leonard R. Enlow.

By: Contributor(s): Series: Materials science and process technology series©1998Edition: 2nd edDescription: 1 online resource (xxi, 579 pages) : illustrationsContent type:
  • text
Media type:
  • computer
Carrier type:
  • computer disc
ISBN:
  • 159124255X
  • 9781591242550
  • 9780815514237
  • 0815514239
  • 9780815519843
  • 0815519842
  • 9780080946597
  • 0080946593
Subject(s): Genre/Form: Additional physical formats: Print version:: Hybrid microcircuit technology handbook.LOC classification:
  • TK7874 .L45 1998eb
Online resources:
Contents:
Introduction -- Substrates -- Thin Film Processes -- Thick Film Processes -- Resistor Trimming -- Parts Selection -- Assembly Processes -- Testing -- Handling and Clean Rooms -- Design Guidelines -- Documentation and Specifications -- Failure Analysis -- Multichip Modules: A New Breed of Hybrid Microcircuits -- References -- Index.
Action note:
  • digitized 2010 HathiTrust Digital Library committed to preserve
Summary: Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines is also present.
Item type: eBooks
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Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines is also present.

Includes bibliographical references and index.

Print version record.

Introduction -- Substrates -- Thin Film Processes -- Thick Film Processes -- Resistor Trimming -- Parts Selection -- Assembly Processes -- Testing -- Handling and Clean Rooms -- Design Guidelines -- Documentation and Specifications -- Failure Analysis -- Multichip Modules: A New Breed of Hybrid Microcircuits -- References -- Index.

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Electronic reproduction. [S.l.] : HathiTrust Digital Library, 2010. MiAaHDL

Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. MiAaHDL

http://purl.oclc.org/DLF/benchrepro0212

digitized 2010 HathiTrust Digital Library committed to preserve pda MiAaHDL

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