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Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers / Jörg Franke.

By: Contributor(s): Language: English Original language: German Publisher: Munich ; Cincinnati, OH : Hanser, [2014]Copyright date: ©2014Description: 1 online resource (xii, 356 pages) : color illustrationsContent type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9781569905524
  • 1569905525
  • 9781680157277
  • 1680157272
Uniform titles:
  • Räumliche elektronische Baugruppen (3D-MID). English
Subject(s): Genre/Form: Additional physical formats: Print version:: No titleLOC classification:
  • TK7874.53 .F7713 2014
Online resources:
Item type: eBooks
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Translated from the German.

Includes bibliographical references and index.

Print version record.

Elsevier ScienceDirect All Books

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