Amazon cover image
Image from Amazon.com

Design and modeling for 3D ICs and interposers / Madhavan Swaminathan, Ki Jin Han.

By: Contributor(s): Series: WSPC series in advanced integration and packaging ; v. 2.Publisher: Singapore ; Hackensack, New Jersey : World Scientific Publishing Company, [2014]Copyright date: �2014Description: 1 online resource (379 pages) : illustrationsContent type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9789814508605 (e-book)
  • 9789814508599
Subject(s): Genre/Form: LOC classification:
  • TA168 .S93 2014eb
Online resources:
Item type: eBooks
Star ratings
    Average rating: 0.0 (0 votes)
No physical items for this record

Includes bibliographical references and index.

Description based on online resource; title from PDF (ebrary, viewed December 30, 2013).

Electronic reproduction. Palo Alto, Calif. : ebrary, 2014. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.

Copyright © 2020 Alfaisal University Library. All Rights Reserved.
Tel: +966 11 2158948 Fax: +966 11 2157910 Email: librarian@alfaisal.edu