Handbook of VLSI microlithography : principles, technology, and applications / edited by John N. Helbert.

Contributor(s):

text

Media type:

computer

Carrier type:

online resource

ISBN:

1591242754
9781591242758
9780815517801
0815517807

Subject(s):

Genre/Form:

Electronic books.

Additional physical formats: Print version:: Handbook of VLSI microlithography.LOC classification:

TK7874 .H3494 2001eb

Online resources:

Click here to access online

Contents:

Issues and Trends Affecting Lithography Tool Selection Strategy -- Resist Technology: Design, Processing and Applications -- Lithography Process Monitoring and Defect Detection -- Techniques and Tools for Photo Metrology -- Techniques and Tools for Optical Lithography -- Microlithography Tool Automation -- Electron Beam ULSI Applications -- Rational Vibration and Structural Dynamics for Lithographic Tool Installations -- Applications of Ion Microbeam Lithography and Direct Processing -- X-Ray Lithography.

Action note:

digitized 2010 HathiTrust Digital Library committed to preserve

Summary: This handbook gives readers a look at the technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings - including optical lithography, electron beam, ion beam, and X-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge, and pattern feature dimension control. The book's explanation of resist and resist process equipment technology describes the relationship between the resist process and equipment parameters. The basics of resist technology are also covered - including an entire chapter on resist process defectivity and the potential yield limiting effect on device production.

Item type:

eBooks

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This handbook gives readers a look at the technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings - including optical lithography, electron beam, ion beam, and X-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge, and pattern feature dimension control. The book's explanation of resist and resist process equipment technology describes the relationship between the resist process and equipment parameters. The basics of resist technology are also covered - including an entire chapter on resist process defectivity and the potential yield limiting effect on device production.

Includes bibliographical references and index.

Print version record.

Use copy Restrictions unspecified star MiAaHDL

Electronic reproduction. [S.l.] : HathiTrust Digital Library, 2010. MiAaHDL

Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. MiAaHDL

http://purl.oclc.org/DLF/benchrepro0212

digitized 2010 HathiTrust Digital Library committed to preserve pda MiAaHDL

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