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VLSI-SoC: Technologies for Systems Integration [electronic resource] : 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, Florianópolis, Brazil, October 12-14, 2009, Revised Selected Papers / edited by Jürgen Becker, Marcelo Johann, Ricardo Reis.

Contributor(s): Series: IFIP Advances in Information and Communication Technology ; 360Publisher: Berlin, Heidelberg : Springer Berlin Heidelberg, 2011Description: X, 202 p. online resourceContent type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9783642231209
Subject(s): Genre/Form: Additional physical formats: Printed edition:: No titleDDC classification:
  • 005.18 23
LOC classification:
  • QA76.635
Online resources: In: Springer eBooksSummary: This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
Item type: eBooks
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This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

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