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	1.		Image from Amazon.com	Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee. by Lee, Ning-Cheng ScienceDirect eBooks ©2002 Online resources: Click here to access online Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
	2.		Image from Amazon.com	Reflow soldering processes and troubleshooting [electronic resource] : SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee. by Lee, Ning-Cheng Safari eBooks c2002 Other title: SMT, BGA, CSP and flip chip technologies Surface mount technology, ball grid array, chip scale packages and flip chip technologies Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)

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