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Carbon Nanotube Based VLSI Interconnects [electronic resource] : Analysis and Design / by Brajesh Kumar Kaushik, Manoj Kumar Majumder.

By: Contributor(s): Series: SpringerBriefs in Applied Sciences and TechnologyPublisher: New Delhi : Springer India : Imprint: Springer, 2015Description: XI, 86 p. 57 illus. online resourceContent type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9788132220473
Subject(s): Genre/Form: Additional physical formats: Printed edition:: No titleDDC classification:
  • 620.5 23
LOC classification:
  • T174.7
Online resources:
Contents:
Interconnects -- Carbon Nanotube – Properties and Applications -- Modeling of Carbon Nanotube Interconnects -- Crosstalk and Delay Analysis -- Mixed Carbon Nanotube Bundle -- References.
In: Springer eBooksSummary: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
Item type: eBooks
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Interconnects -- Carbon Nanotube – Properties and Applications -- Modeling of Carbon Nanotube Interconnects -- Crosstalk and Delay Analysis -- Mixed Carbon Nanotube Bundle -- References.

The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

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