Characterization of integrated circuit packaging materials [electronic resource] / editors, Thomas M. Moore and Robert G. McKenna.
Series: Materials characterization series2010Description: 1 online resource (xx, 274 p.) : illSubject(s): Genre/Form: Additional physical formats: Print version:: Characterization of integrated circuit packaging materials.Online resources:
eBooks
Description based on print version record.
"First published by Butterworth-Heinemann in 1993...Reissued volume published in 2010 by Momentum Press"--T.p. verso.
IC package reliability testing / Lawrence C. Wagner -- Mold compound adhesion and strength / Samuel S. Kim -- Mechanical stress in IC packages / Darvin R. Edwards and Steven K. Groothuis -- Moisture sensitivity and delamination / Thomas M. Moore, Robert G. McKenna, and Shawn J. Kelsall -- Thermal management / Mostafa Aghazedeh -- Electrical performance of IC packages / Eric Bogatin -- Solderability of integrated circuits / James A. Kargol, Anthony M. Petrucci, and Timothy M. McGuiggan -- Hermeticity and joining in ceramic IC packages / Stephen R. Martin -- Advanced interconnect technology / Robert G. McKenna and Thomas M. Moore.
Includes bibliographical references and index.