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1.	Image from Amazon.com	Optimum Cooling of Data Centers [electronic resource] : Application of Risk Assessment and Mitigation Techniques / by Jun Dai, Michael M. Ohadi, Diganta Das, Michael G. Pecht. by Dai, Jun [author.] Ohadi, Michael M [author.] Das, Diganta [author.] Pecht, Michael G [author.] SpringerLink (Online service) Publisher: New York, NY : Springer New York : Imprint: Springer, 2014 In: Springer eBooks Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
2.	Image from Amazon.com	Copper Wire Bonding [electronic resource] / by Preeti S Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G Pecht. by Chauhan, Preeti S [author.] Choubey, Anupam [author.] Zhong, ZhaoWei [author.] Pecht, Michael G [author.] SpringerLink (Online service) Publisher: New York, NY : Springer New York : Imprint: Springer, 2014 In: Springer eBooks Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
3.	Image from Amazon.com	Encapsulation technologies for electronic applications / Haleh Ardebili, Michael G. Pecht. by Ardebili, Haleh Pecht, Michael G ScienceDirect eBooks Series: Materials and processes for electronic applications series2009 Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)

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