Electronic failure analysis handbook [electronic resource] : techniques and applications for electronic and electrical packages, components, and assemblies / Perry L. Martin.
Series: McGraw-Hill's AccessEngineeringPublication details: New York : McGraw-Hill, [2000]Description: 1 electronic text : illISBN:- 0071449639
- 9780070410442
- Electronic apparatus and appliances -- Reliability
- System failures (Engineering)
- Microelectronics
- Semiconductors
- Acoustic imaging
- Infrared photography
- Electron microscopy
- X-ray microscopy
- Metallography
- Semiconductors -- Defects
- Solder and soldering
- Printed circuits
- Electronic apparatus and appliances -- Defects
- Electronics -- Materials -- Defects
- 621.381 22
- TK7870.23 .M37 1999
- Also issued in print and PDF version.
eBooks
Print version c1999.
Includes bibliographical references and index.
Pt. 1. Introduction to electronic failure analysis -- pt. 2. Electronic failiure analysis techniques -- pt. 3. Electronic failure analysis for specific technologies.
Ch. 1. Overview of electronic component reliability -- ch. 2. Overview of electronic systems reliability -- ch. 3. Product liability -- ch. 4. Photography and optical microscopy -- ch. 5. X-ray/radiographic component inspection -- ch. 6. Infrared thermography -- ch. 7. Acoustic micro imaging failure analysis of electronic devices -- ch. 8. Metallography -- ch. 9. Chemical characterization -- ch. 10. Electronic and electrical characterization -- ch. 11. Scanning electron microscopy and x-ray analysis -- ch. 12. Miscellaneous techniques -- ch. 13. Solder joints -- ch. 14. Failure analysis of printed wiring assemblies -- ch. 15. Wires and cables -- ch. 16. Switches and relays -- ch. 17. Connection technology -- ch. 18. Failure analysis of components -- ch. 19. Semiconductors -- ch. 20. Power and high-voltage considerations.
Also issued in print and PDF version.
Description based on cover image and table of contents, viewed on April 23, 2007.