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	1.		Image from Amazon.com	Vertical 3D memory technologies / Betty Prince. by Prince, Betty [author.] ebrary, Inc Publisher: Chichester, England : Wiley, 2014Copyright date: �2014 Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
	2.		Image from Amazon.com	Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li. by Li, Er-Ping Wiley eBooks Publication details: [United States] : Hoboken : IEEE Press ; Wiley, ©2012 Online resources: Click here to access online Click here to access online Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
	3.		Image from Amazon.com	Vertical 3D memory technologies / Betty Prince. by Prince, Betty Wiley eBooks Publisher: Chichester, West Sussex, United Kingdom : Wiley, [2014] Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
	4.		Image from Amazon.com	Handbook of 3D Integration : 3D process technology / edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm. by Garrou, Philip E [editor.] Koyanagi, Mitsumasa [editor.] Ramm, Peter [editor.] Wiley eBooks Publisher: Weinheim, Germany : Wiley-VCH, 2014 Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
	5.		Image from Amazon.com	Three-dimensional integrated circuit design / Vasilis F. Pavlidis, Ioannis Savidis, Eby G. Friedman. by Pavlidis, Vasilis F, 1976- [author.] Savidis, Ioannis [author.] Frian, Eby G [author.] ScienceDirect eBooks Edition: Second edition. Publisher: Cambridge, MA : Morgan Kaufmann is an imprint of Elsevier, [2017] Online resources: Click here to access online Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
	6.		Image from Amazon.com	Vertical 3D memory technologies / Betty Prince. by Prince, Betty [author.] Safari eBooks Publisher: Chichester, United Kingdom : John Wiley & Sons, 2014 Other title: Vertical three dimensional memory technologies Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
	7.		Image from Amazon.com	Through-Silicon Vias for 3D Integration / John H. Lau. by Lau, John H [author.] McGraw-Hill eBooks Language: English Publisher: New York, N.Y. : McGraw-Hill Education LLC., c2013Copyright date: ©2013 Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
	8.		Image from Amazon.com	3D IC integration and packaging / John H. Lau. by Lau, John H [author.] McGraw-Hill eBooks Language: English Publisher: New York, N.Y. : McGraw-Hill Education LLC., c2016Copyright date: ©2016 Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)

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