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	1.		Image from Amazon.com	Handbook of wafer bonding [electronic resource] / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo. by Ramm, Peter Lu, James Jian-Qiang Taklo, Maaike M. V ebrary, Inc Publication details: Weinheim, Germany : Wiley-VCH, 2012 Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
	2.		Image from Amazon.com	Interlayer dielectrics for semiconductor technologies / edited by S.P. Murarka, M. Eizenberg, A.K. Sinha. by Murarka, S. P Eizenberg, M. (Moshe) Sinha, A. K. (Ashok K.) ScienceDirect eBooks 2003 Online resources: Click here to access online Availability: No items available. Place hold Save to lists Add to cart (remove)
	3.		Image from Amazon.com	Microchip fabrication : a practical guide to semiconductor processing [electronic resource] / Peter Van Zant. by Van Zant, Peter McGraw-Hill eBooks Series: McGraw-Hill's AccessEngineering Edition: 5th ed. Publication details: New York : McGraw-Hill, [2004] Online resources: Subscription required Availability: No items available. Place hold Save to lists Add to cart (remove)
	4.		Image from Amazon.com	IC layout basics [electronic resource] : a practical guide / Christopher Saint, Judy Saint. by Saint, Christopher, 1961- Saint, Judy McGraw-Hill eBooks Series: McGraw-Hill's AccessEngineering Publication details: New York : McGraw-Hill, [2002] Online resources: Subscription required Availability: No items available. Place hold Save to lists Add to cart (remove)

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