| 000 | 03665cam a2201057 a 4500 | ||
|---|---|---|---|
| 001 | ccn00230187 | ||
| 006 | m f d | ||
| 007 | cr cn ---uuauu | ||
| 008 | 081021s2008 nyua fob 001 0 eng | ||
| 010 | _z 2008016996 | ||
| 020 | _a0071603158 | ||
| 020 | _z0071459065 (print) | ||
| 020 | _a9780071459068 | ||
| 049 | _aAlfaisal Main Library | ||
| 050 | 4 |
_aTK7870.15 _b.T86 2008 |
|
| 082 | 0 | 4 |
_a621.381/046 _222 |
| 100 | 1 |
_aTummala, Rao R., _d1942- |
|
| 245 | 1 | 0 |
_aIntroduction to system-on-package (SOP) _h[electronic resource] : _bminiaturization of the entire system / _cRao R. Tummala, Madhavan Swaminathan. |
| 246 | 1 |
_iOnline index title: _aSystem on package: miniaturization of the entire system |
|
| 260 |
_aNew York : _bMcGraw-Hill, _c[2008] |
||
| 300 |
_a1 electronic text (xx, 785 p.) : _bill. |
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| 490 | 1 | _aMcGraw-Hill's AccessEngineering | |
| 500 | _aPrint version c2008. | ||
| 504 | _aIncludes bibliographical references and index. | ||
| 530 | _aAlso issued in print and PDF version. | ||
| 588 | _aDescription based on cover image and table of contents, viewed on October 21, 2008. | ||
| 650 | 0 |
_aMultichip modules (Microelectronics) _xDesign and construction. |
|
| 650 | 0 | _aMicroelectronic packaging. | |
| 655 | 7 |
_aElectronic books. _2local |
|
| 700 | 1 | _aSwaminathan, Madhavan. | |
| 700 | 1 | _aBandyopadhyay, Tapobrata. | |
| 700 | 1 | _aMehendale, Mahesh. | |
| 700 | 1 | _aRao, Jagdish. | |
| 700 | 1 | _aLee, Baik-Woo. | |
| 700 | 1 | _aYoon, Chong K. | |
| 700 | 1 | _aBrown, Kenneth M. | |
| 700 | 1 | _aEngin, A. Ege. | |
| 700 | 1 | _aGovind, Vinu. | |
| 700 | 1 | _aBavisi, Amit. | |
| 700 | 1 | _aPapapolymerou, John. | |
| 700 | 1 | _aTentzeris, Manos. | |
| 700 | 1 | _aLaskar, Joy. | |
| 700 | 1 | _aBhattacharya, Swapan. | |
| 700 | 1 | _aChang, Gee-Kung. | |
| 700 | 1 | _aGaylord, Thomas. | |
| 700 | 1 | _aVallalaz, Ricardo. | |
| 700 | 1 | _aGuidotti, Daniel. | |
| 700 | 1 | _aChen, Ray T. | |
| 700 | 1 | _aSundaram, Venky. | |
| 700 | 1 | _aLiu, Fuhan. | |
| 700 | 1 | _aKrishnan, Ganesh. | |
| 700 | 1 | _aWhite, George. | |
| 700 | 1 | _aKohl, Paul. | |
| 700 | 1 | _aRaj, P. Markondeya. | |
| 700 | 1 | _aPucha, Raghuram V. | |
| 700 | 1 | _aQu, Jianmin. | |
| 700 | 1 | _aSitaraman, Suresh K. | |
| 700 | 1 | _aMonajemi, Pejman. | |
| 700 | 1 | _aAyazi, Farrokh. | |
| 700 | 1 | _aSparks, Douglas. | |
| 700 | 1 | _aZhang, Zhuqing. | |
| 700 | 1 | _aLi , Y. | |
| 700 | 1 | _aWong, C. P. | |
| 700 | 1 | _aJoshi, Y. | |
| 700 | 1 | _aJha, Gopal C. | |
| 700 | 1 | _aPatterson, M. | |
| 700 | 1 | _aDutta, P. | |
| 700 | 1 | _aAkbay, S. S. | |
| 700 | 1 | _aKeezer, D. | |
| 700 | 1 | _aChatterjee, A. | |
| 700 | 1 | _aJanagama, Dasharathan G. | |
| 700 | 1 | _aLiu, Jin. | |
| 700 | 1 | _aIyer, Mahadevan K. | |
| 710 | 2 | _aMcGraw-Hill eBooks. | |
| 740 | 0 | 2 | _aIntroduction to the system-on-package (SOP) technology. |
| 740 | 0 | 2 | _aIntroduction to system-on-chip (SOC). |
| 740 | 0 | 2 | _aStacked ICS and packages (SIP). |
| 740 | 0 | 2 | _aMixed-signal (SOP) design. |
| 740 | 0 | 2 | _aRadio frequency systemon-package (RF SOP). |
| 740 | 0 | 2 | _aIntegrated chip-to-chip optoelectronic SOP. |
| 740 | 0 | 2 | _aSOP substrate with multilayer wiring and thin-film embedded components. |
| 740 | 0 | 2 | _aMixed-signal (SOP) reliability. |
| 740 | 0 | 2 | _aMEMS packaging. |
| 740 | 0 | 2 | _aWafer-level SOP. |
| 740 | 0 | 2 | _aThermal SOP. |
| 740 | 0 | 2 | _aElectrical test of SOP modules and systems. |
| 740 | 0 | 2 | _aBiosensor SOP. |
| 830 | 0 | _aMcGraw-Hill's AccessEngineering. | |
| 856 | 4 | 0 |
_uhttp://ezproxy.alfaisal.edu/login?url=http://accessengineeringlibrary.com/browse/system-on-package-miniaturization-of-the-entire-system _zSubscription required |
| 942 |
_2lcc _cEBOOKS |
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| 997 | _a(c)2008 Cassidy Cataloguing Services, Inc. | ||
| 999 |
_c592786 _d592786 |
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