| 000 | 05650cam a2201525 a 4500 | ||
|---|---|---|---|
| 001 | ccn00213593 | ||
| 006 | m f d | ||
| 007 | cr cn ---uuauu | ||
| 008 | 070426s2001 nyua fobf 001 0 eng d | ||
| 010 | _z 2001273178 | ||
| 020 | _z0071371699 (print) | ||
| 020 | _a0071450033 | ||
| 020 | _a9780071371698 | ||
| 049 | _aAlfaisal Main Library | ||
| 050 | 4 |
_aTK7870.15 _b.F86 2001 |
|
| 082 | 0 | 4 |
_a621.381/046 _222 |
| 245 | 0 | 0 |
_aFundamentals of microsystems packaging _h[electronic resource] / _cRao R. Tummala, editor. |
| 260 |
_aNew York : _bMcGraw-Hill, _c[2001] |
||
| 300 |
_a1 electronic text (vii, 967 p.) : _bcol. ill. |
||
| 490 | 1 | _aMcGraw-Hill's AccessEngineering | |
| 500 | _aPrint version c2001. | ||
| 504 | _aIncludes bibliographical references and index. | ||
| 505 | 0 | _uhttp://www.loc.gov/catdir/toc/mh023/2001273178.html | |
| 530 | _aAlso issued in print and PDF version. | ||
| 545 | 0 |
_aContributor biographical information: _uhttp://www.loc.gov/catdir/bios/mh041/2001273178.html |
|
| 588 | _aDescription based on cover image and table of contents, viewed on April 26, 2007. | ||
| 650 | 0 | _aElectronic packaging. | |
| 650 | 0 | _aMicroelectronic packaging. | |
| 650 | 0 |
_aMiniature electronic equipment _xPackaging. |
|
| 650 | 0 |
_aElectronic packaging _xDesign. |
|
| 650 | 0 |
_aElectronic apparatus and appliances _xTemperature control. |
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| 650 | 0 | _aChip scale packaging. | |
| 650 | 0 | _aMultichip modules (Microelectonics) | |
| 650 | 0 | _aIntegrated circuits. | |
| 650 | 0 | _aIntegrated circuits industry. | |
| 650 | 0 | _aPassive components. | |
| 650 | 0 | _aIntegrated passive components. | |
| 650 | 0 | _aOptoelectronics. | |
| 650 | 0 | _aRadio frequency integrated circuits. | |
| 650 | 0 | _aMicroelectromechanical systems. | |
| 650 | 0 | _aSealing (Technology) | |
| 650 | 0 | _aMiniature electronic equipment (Bonding) | |
| 650 | 0 |
_aElectronic apparatus and appliances _xPlastic embedment. |
|
| 650 | 0 |
_aElectronics _xMaterials _xSurfaces. |
|
| 650 | 0 |
_aSemiconductors _xSurfaces. |
|
| 650 | 0 |
_aPrinted circuits _xDesign and construction. |
|
| 650 | 0 | _aSurface mount technology. | |
| 650 | 0 |
_aElectronic packaging _xMaterials. |
|
| 650 | 0 |
_aMicroelectronic packaging _xMaterials. |
|
| 650 | 0 |
_aElectronics _xTesting. |
|
| 650 | 0 |
_aMicroelectronics _xTesting. |
|
| 650 | 0 |
_aMicroelectronics _xDesign. |
|
| 650 | 0 |
_aElectronic apparatus and appliances _xReliability. |
|
| 655 | 7 |
_aElectronic books. _2local |
|
| 700 | 1 |
_aTummala, Rao R., _d1942- |
|
| 700 | 1 | _aMorris, James E. | |
| 700 | 1 | _aDavidson, Evan. | |
| 700 | 1 | _aSarma, D. H. R. | |
| 700 | 1 | _aHubbard, Bob. | |
| 700 | 1 | _aRao, N. J. | |
| 700 | 1 | _aSwaminathan, Madhavan. | |
| 700 | 1 | _aPeterson, Andrew F. | |
| 700 | 1 | _aKim, Juongho. | |
| 700 | 1 | _aSitaraman, Suresh K. | |
| 700 | 1 | _aPang, John H. L. | |
| 700 | 1 | _aBar-Cohen, Avram. | |
| 700 | 1 | _aWatwe, Abhay. | |
| 700 | 1 | _aSeetharamu, Kankanhally N. | |
| 700 | 1 | _aKamath, Sundar M. | |
| 700 | 1 | _aCharles, Harry K. | |
| 700 | 1 | _aBaldwin, David F. | |
| 700 | 1 | _aGarrou, Phil. | |
| 700 | 1 | _aPrymak, John. | |
| 700 | 1 | _aBhattacharya, Swapan. | |
| 700 | 1 | _aPaik, Kyung. | |
| 700 | 1 | _aCruz Rivera, Jose L. | |
| 700 | 1 | _aGaylord, Thomas K. | |
| 700 | 1 | _aGlytsis, Elias N. | |
| 700 | 1 | _aLaskar, Joy. | |
| 700 | 1 | _aTentzeris, Emmanouil M. | |
| 700 | 1 | _aSchutt-Aine, Jose E. | |
| 700 | 1 | _aRamesham, Rajeshuni. | |
| 700 | 1 | _aGhaffarian, Reza. | |
| 700 | 1 | _aAyazi, Farrokh. | |
| 700 | 1 | _aWong, C. P. | |
| 700 | 1 | _aFang, Treliant. | |
| 700 | 1 | _aVaradarajan, Mahesh. | |
| 700 | 1 | _aIllyefalvi-Vitez, Zsolt. | |
| 700 | 1 | _aZImmermann, Joachim. | |
| 700 | 1 | _aMattsson, Fredrik. | |
| 700 | 1 | _aKandelid, Stefan. | |
| 700 | 1 | _aRaj, Pulugurtha Markondeya. | |
| 700 | 1 | _aLiu, Johan. | |
| 700 | 1 | _aOhlckers, Per. | |
| 700 | 1 | _aKeezer, David. | |
| 700 | 1 | _aKim, Bruce. | |
| 700 | 1 | _aKoppolu, Sasidhar. | |
| 700 | 1 | _aMay, Gary S. | |
| 700 | 1 | _aShinotani, Ken-ichi. | |
| 700 | 1 | _aMalmodin, Jens. | |
| 700 | 1 | _aTrankell, Richard. | |
| 700 | 1 | _aQu, Jianmin. | |
| 700 | 1 | _aGuo, Yifan. | |
| 710 | 2 | _aMcGraw-Hill eBooks. | |
| 740 | 0 | 2 | _aIntroduction to microsystems packaging. |
| 740 | 0 | 2 | _aRole of packaging in microelectronics. |
| 740 | 0 | 2 | _aRole of packaging in microsystems. |
| 740 | 0 | 2 | _aFundamentals of electrical package design. |
| 740 | 0 | 2 | _aFundamentals of design for reliability. |
| 740 | 0 | 2 | _aFundamentals of thermal management. |
| 740 | 0 | 2 | _aFundamentals of single chip packaging. |
| 740 | 0 | 2 | _aFundamentals of multichip packaging. |
| 740 | 0 | 2 | _aFundamentals of IC assembly. |
| 740 | 0 | 2 | _aFundamentals of wafer-level packaging. |
| 740 | 0 | 2 | _aFundamentals of passives : discrete, integrated, and embedded. |
| 740 | 0 | 2 | _aFundamentals of optoelectronics. |
| 740 | 0 | 2 | _aFundamentals of RF packaging. |
| 740 | 0 | 2 | _aFundamentals of microelectromechanical systems. |
| 740 | 0 | 2 | _aFundamentals of sealing and encapsulation. |
| 740 | 0 | 2 | _aFundamentals of system-level PWB technologies. |
| 740 | 0 | 2 | _aFundamentals of board assembly. |
| 740 | 0 | 2 | _aFundamentals of packaging materials and processes. |
| 740 | 0 | 2 | _aFundamentals of electrical testing. |
| 740 | 0 | 2 | _aFundamentals of package manufacturing. |
| 740 | 0 | 2 | _aFundamentals of microsystems design for environment. |
| 740 | 0 | 2 | _aFundamentals of microsystems reliability. |
| 830 | 0 | _aMcGraw-Hill's AccessEngineering. | |
| 856 | 4 | 0 |
_uhttp://ezproxy.alfaisal.edu/login?url=http://accessengineeringlibrary.com/browse/fundamentals-of-microsystems-packaging _zSubscription required |
| 942 |
_2lcc _cEBOOKS |
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| 997 | _a(c)2007 Cassidy Cataloguing Services, Inc. | ||
| 999 |
_c592895 _d592895 |
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